PCB Ball Grid Array (BGA) Fabrication & Assembly Services

A ball grid array (BGA), which is a type of surface mount packaging, is a pattern of small metallic balls used for integrated circuits. Surface mount refers to either mounting or placing components directly onto a printed circuit board.

BGAs come in a range of packages — from fewer than 10 balls (or pins) per pattern to more than 1,700. An electrical engineer will determine the number of pins on a board during the design phase, which will dictate the complexity of the project and number of layers.

 

BGA Package Types

  • Plastic
  • Ceramic
  • Smaller BGAs may also come on either tape or in a tray prior to assembly.
  • Micro BGAs must be placed by a machine due to their size.
  • A flip chip package refers to a mounting approach in which the chip is inverted and connected directly to the substrate rather than using the more common wire bonding technique.

Advantages of BGA PCB Packages

One of the major benefits of BGAs is electrical improvement in compact spaces. They also provide a more efficient use of space. And since BGA pads are often large, it allows for easier soldering work, which can speed up the fabrication process.

BGA Fabrication & Assembly Applications

BGAs are an extremely common PCB component and are used in a variety of applications and industries, including:

Lead Times for PCB BGA Fabrication & Assembly Services

BGAs are part of the standard PCB assembly and fabrication process, which means they do not impact lead times. Our lead time for standard rigid PCBs is 10 days and 15 days for flex and rigid-flex circuits. We also have quick turn capabilities with a one to five-day turnaround.

Cirexx Is Your BGA Fabrication & Assembly Partner

We pride ourselves on the ability to take on complex jobs — from layout to assembly — all under one roof with state-of-the-art technology, including a new selective soldering machine.

Our engineering team uses best practices for flex and rigid-flex assembly, and our operators understand how to properly assemble flex circuits to avoid delamination. We have extensive experience working with a variety of BGA packages and can help answer any questions you may have. We also have the ability to re-ball components if you’re opting to reuse a BGA.

 

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We thoroughly review and evaluate the design of all custom circuit board quotes with electronic data and software to provide a 24-hour response time. After you upload your information, including any fabrication drawings or schematics, our system and engineering staff will analyze the data and provide us with a comprehensive document so we can take a closer look at your project.

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